Three Dimensional Printing Technique and Its Application to Bone Tumor Surgery.
10.4055/jkoa.2018.53.6.466
- Author:
Hyun Guy KANG
1
;
Jong Woong PARK
;
Dae Woo PARK
Author Information
1. Orthpaedic Oncology Clinic, National Cancer Center, Goyang, Korea. ostumor@ncc.re.kr
- Publication Type:Review
- Keywords:
bone tumor;
3-dimensional printing;
personalized;
customized;
prosthesis and implants;
surgical guide
- MeSH:
Congenital Abnormalities;
Delivery of Health Care;
Humans;
Limb Salvage;
Models, Anatomic;
Orthotic Devices;
Printing, Three-Dimensional*;
Spondylarthritis;
Surgeons
- From:The Journal of the Korean Orthopaedic Association
2018;53(6):466-477
- CountryRepublic of Korea
- Language:Korean
-
Abstract:
Orthopaedics is an area where 3-dimensional (3D) printing technology is most likely to be utilized because it has been used to treat a range of diseases of the whole body. For arthritis, spinal diseases, trauma, deformities, and tumors, 3D printing can be used in the form of anatomical models, surgical guides, metal implants, bio-ceramic body reconstruction, and orthosis. In particular, in orthopaedic oncology, patients have a wide variety of tumor locations, but limited options for the limb salvage surgery have resulted in many complications. Currently, 3D printing personalized implants can be fabricated easily in a short time, and it is anticipated that all bone tumors in various surgical sites will be reconstructed properly. An improvement of 3D printing technology in the healthcare field requires close cooperation with many professionals in the design, printing, and validation processes. The government, which has determined that it can promote the development of 3D printing-related industries in other fields by leading the use of 3D printing in the medical field, is also actively supporting with an emphasis on promotion rather than regulation. In this review, the experience of using 3D printing technology for bone tumor surgery was shared, expecting orthopaedic surgeons to lead 3D printing in the medical field.