Effect of the exponential curing of composite resin on the microtensile dentin bond strength of adhesives.
10.5395/JKACD.2010.35.2.125
- Author:
So Rae SEONG
1
;
Duck kyu SEO
;
In Bog LEE
;
Ho Hyun SON
;
Byeong Hoon CHO
Author Information
1. Department of Conservative Dentistry, School of Dentistry, Seoul National University, Seoul, Korea. chobh@snu.ac.kr
- Publication Type:Original Article
- Keywords:
Polymerization shrinkage;
Exponential curing;
Dentin adhesive;
Microtensile bond strength;
Failure mode
- MeSH:
Adhesives;
Bisphenol A-Glycidyl Methacrylate;
Chimera;
Dentin;
Humans;
Light;
Molar;
Polymerization;
Polymers;
Resin Cements
- From:Journal of Korean Academy of Conservative Dentistry
2010;35(2):125-133
- CountryRepublic of Korea
- Language:Korean
-
Abstract:
OBJECTIVES: Rapid polymerization of overlying composite resin causes high polymerization shrinkage stress at the adhesive layer. In order to alleviate the shrinkage stress, increasing the light intensity over the first 5 seconds was suggested as an exponential curing mode by an LED light curing unit (Elipar FreeLight2, 3M ESPE). In this study, the effectiveness of the exponential curing mode on reducing stress was evaluated with measuring microtensile bond strength of three adhesives after the overlying composite resin was polymerized with either continuous or exponential curing mode. METHODS: Scotchbond Multipurpose Plus (MP, 3M ESPE), Single Bond 2 (SB, 3M ESPE), and Adper Prompt (AP, 3M ESPE) were applied onto the flat occlusal dentin of extracted human molar. The overlying hybrid composite (Denfil, Vericom, Korea) was cured under one of two exposing modes of the curing unit. At 48h from bonding, microtensile bond strength was measured at a crosshead speed of 1.0 mm/min. The fractured surfaces were observed under FE-SEM. RESULTS: There was no statistically significant difference in the microtensile bond strengths of each adhesive between curing methods (Two-way ANOVA, p > 0.05). The microtensile bond strengths of MP and SB were significantly higher than that of AP (p < 0.05). Mixed failures were observed in most of the fractured surfaces, and differences in the failure mode were not observed among groups. CONCLUSION: The exponential curing method had no beneficial effect on the microtensile dentin bond strengths of three adhesives compared to continuous curing method.
