3D electrical impedance finite element joint modeling and simulation using COMSOL and Visual C++

VernacularTitle:COMSOL与Visual C++三维电阻抗有限元联合建模与仿真研究
Author: Tao ZHANG ¹ ; rui Wei ZHANG ; hua Can XU ; Meng DAI ; Bin YANG ; tao Xue SHI ; zhen Xiu DONG ; Feng FU
Author Information

1. 原兰州军区联勤部药品仪器检验所
Keywords: electrical impedance tomography; joint simulation; 3D; COMSOL; Visual C++
From: Chinese Medical Equipment Journal 2017;38(8):1-4
CountryChina
Language:Chinese
Abstract: Objective To put forward a method for 3D electrical impedance finite element joint modeling and simulation using COMSOL for visual modeling and Visual C++ for programming.Methods A model was established with COMSOL,and then transformed into a.stl file and introduced into Visual C++ simulation platform.Delaunay tetrahedral mesh generation algorithm was used for finite element meshing,calculation and simulation,and joint modeling and simulation were realized finally.Results Simulation result showed that the method could be used to introduce COMSOL model and complete 3D finite element simulation.Conclusion The method proves its compatibility with the models generated by multi software and practicability for joint modeling and simulation.