Effect of baking temperature of gold-porcelain blended layer on bond strength of porcelain fused to Ni-Cralloy
- VernacularTitle:金瓷混合涂层烧结温度对镍铬合金与瓷结合强度的影响
- Author:
Mengtao LIU
;
Anqi JIA
;
Qinghong ZHANG
- Publication Type:Journal Article
- Keywords:
Porcelain fused to metal;
Gold intermediate layer;
Bond s trength
- From:
Journal of Practical Stomatology
2001;0(03):-
- CountryChina
- Language:Chinese
-
Abstract:
Objective:To compare the differences of bond strength usi ng gold intermediate layer between Ni-Cr alloy and opaque porcelain(OP) baked at different temperatures. Methods:36 standard samples of Ni-Cr al loy and 36 of gold were prepared. The samples were divided into 4 groups with 9 in each. In group 1,OP was smeared to the surface of the samples and then baked at 950 ℃. In group 2,3 and 4 blendgold neu(a gold past) was put on the surface of the samples, then baked at 820 ℃,890 ℃ and 960 ℃ respectively. The samples were proccessed for further tests.The bond strength was tested by shear bond te st, and the electron probe was used to observe interfacial bond state and diffus ion of interfacial elements. Results:The bond strength(MPa) in g roup 1,2,3 and 4 was 19.66? 1.83,22.34?2.73,21.33?2.75 and 28.02?5.71 res pectively(group 1 vs group 4 P
