A qualitative analysis of bonding between electroformed surface and veneering ceramics.
- Author:
Ho Beom KWON
1
;
Soon Ho YIM
Author Information
1. Department of Prosthodontics, School of Medicine, Sungkyunkwan University, Korea.
- Publication Type:Original Article
- MeSH:
Ceramics*;
Dental Porcelain;
Fires;
Microscopy, Electron, Scanning
- From:The Journal of Korean Academy of Prosthodontics
2000;38(3):328-335
- CountryRepublic of Korea
- Language:English
-
Abstract:
STATEMENT of THE PROBLEM: Recently an innovative method of fabricating indirect restorations by gold electroforming has been developed. But the bond quality and strength of the gold coping to the porcelain is uncertain. PURPOSE of STUDY: The purpose of this study is to analyze and evaluate the electroformed gold surface for mechanical bonding between the gold and the ceramic veneering. METHODS and MATERIAL: Electroformed disks were made using electroforming technique. And the surface of the electroformed coping was analyzed after sandblasting, heat-treatment, bonding agent application, opaque porcelain firing with scanning electron microscopy and energy dispersive x-ray analysis. Results. In the analysis with SEM, Sandblasting made the sharp edges and undercuts on the electroformed surface, and after bonding agent application, net-like structure were created on the electroformed surface. In the energy dispersive x-ray analysis it is confirmed that electroformed surface contains some impurities. CONCLUSION: With the use of sandblasting and bonding agent, electroformed surface seems to be enough to bond with veneering porcelain.
