Effect of different polymerization methods on shear bond strength between polymethyl methacrylate and silicone soft liner.
- Author:
Fubao ZHANG
;
Lianshui SHI
;
Li DENG
;
Lin ZHANG
;
Yongfa ZENG
;
Tao TU
- Publication Type:Journal Article
- MeSH: Dental Bonding; Denture Liners; Dimethylpolysiloxanes; Materials Testing; Polymerization; Polymethyl Methacrylate; Silicone Elastomers; Silicones; Tensile Strength
- From: West China Journal of Stomatology 2014;32(3):292-296
- CountryChina
- Language:Chinese
-
Abstract:
OBJECTIVETo compare shear bond strength (SBS) between two types of silicone soft liner and polymethyl methacrylate (PMMA) under the condition of heat curing and room temperature curing.
METHODSA total of 48 PMMA specimens (50 mm x 10 mm x 3 mm) were made by water-bath heating method, and randomly divided into four groups. By using Ufi Gel P (UGP) as soft liner material, group A1 was prepared under heat curing, and group A2 was prepared under room temperature curing. To form the other two groups, Silagum-Comfort (SLC) as soft-liner material was used. Group B1 was prepared under heat curing, and group B2 was prepared under room temperature curing. Shear bond strength (SBS) was tested by using the electronic universal testing machine. The adhesives layer and surface of silastic and PMMA were observed by optical microscope and scanning electron microscopy (SEM).
RESULTSThe SBS of groups A1, A2, B1, B2 were (2.39 +/- 0.24), (1.74 +/- 0.27), (3.09 +/- 0.26), and (2.21 +/- 0.29) MPa, respectively. Significant differences were found between A1 and A2, B1 and B2, A1 and B1, and A2 and B2 (P < 0.05). Optical microscope showed numerous bubbles in the cured UGP, and no air bubbles in the SLC. The surface of PMMA was rough. SEM images showed that each group had continual consistent adhesive interface and a whisker hump on the adhesive layer of A2 and B2.
CONCLUSIONThe SBS ofUGP, SLC, and PMMA achieved minimum clinical standard of 0.44 MPa. The SBS of UGP and PMMA were higher than that of SLC and PMMA. The polymerization method of heat curing was higher than room temperature curing.