The effect of thermocycling on the durability of dentin adhesive systems.
10.5395/JKACD.2007.32.3.222
- Author:
Young Hoon MOON
1
;
Jong Ryul KIM
;
Kyung Kyu CHOI
;
Sang Jin PARK
Author Information
1. Department of Conservative Dentistry, Division of Dentistry, Graduate of Kyung Hee University, Korea. psangjin@khu.ac.kr
- Publication Type:Original Article
- Keywords:
Thermocycling;
Bond strength;
microTBS;
Type of solvent;
Total-etch;
Self-etch
- MeSH:
Adhesives*;
Dentin*;
Diamond;
Molar;
Tooth;
Water
- From:Journal of Korean Academy of Conservative Dentistry
2007;32(3):222-235
- CountryRepublic of Korea
- Language:Korean
-
Abstract:
The objectives of this study was to evaluate the effect of thermocycling on the microTBS (microtensile bond strength) to dentin with four different adhesive systems to examine the bonding durability. Freshly extracted 3rd molar teeth were exposed occlusal dentin surfaces, and randomly distributed into 8 adhesive groups: 3-steps total-etching (Scotchbond Multi-Purpose Plus; SM, All Bond-2; AB), 2-steps total-etching (Single Bond; SB, One Step plus; OS), 2-steps self-etching (Clearfil SE Bond; SE, AdheSE; AD) and single-step self-etching systems (Promp L-Pop; PL, Xeno III; XE). Each adhesive system in 8 adhesives groups was applied on prepared dentin surface as an instruction and resin composite (Z250) was placed incrementally and light-cured. The bonded specimens were sectioned with low-speed diamond saw to obtain 1 x 1 mm sticks after 24 hours of storage at 37degrees C distilled water and proceeded thermocycling at the pre-determined cycles of 0, 1,000 and 2,000. The microTBS test was carried out with EZ-tester at 1 mm/min. The results of bond strength test were statistically analyzed using one-way ANOVA/Duncan's test at the alpha < 0.05 confidence level. Also, the fracture mode of debonded surface and the interface were examined under SEM. The results of this study were as follows; 1. 3-step total etching adhesives showed stable, but bond strength of 2-step adhesives were decreased as thermocycling stress. 2. SE showed the highest bond strength, but single step adhesives (PL, XE) had the lowest value both before and after thermocycling. 3. Most of adhesives showed adhesive failure. The total-etching systems were prone to adhesive failure and the single-step systems were mixed failure after thermocycling. Within limited results of this study, the bond strength of adhesive system was material specific and the bonding durability was affected by the bonding step/procedure of adhesive. Simplified bonding procedures do not necessarily imply improved bonding performance.
