EFFECT OF GOLD ELECTRODEPOSIT ON THE BOND STRENGTH BETWEEN ALLOYS AND VENEERED RESIN.
- Author:
Hong So YANG
1
;
Yeong Joon PARK
Author Information
1. Department of Prosthodontics, chonnam National University, Korea.
- Publication Type:Original Article
- MeSH:
Alloys*;
Aluminum Oxide
- From:The Journal of Korean Academy of Prosthodontics
1997;35(1):103-117
- CountryRepublic of Korea
- Language:Korean
-
Abstract:
The purpose of this experiment was to determind whether the gold electrodeposit on Pd-Ag and Ni-Cr alloys influences on the shear bond strength between veneering resin and silicoated metal surface. All the metal specimens were sandblasted with 250microneter aluminum oxide and followed by silicoating and resin veneering. According to the metal surfaces to be veneered, experimental groups were divided into five. Group Prec : Gold alloy without gold coating Group Semi : Pd-Ag alloy without gold coating Group Base : Ni-Cr alloy without gold coating Group Semi-G : Pd-Ag alloy with gold coating Group Base-G : Ni-Cr alloy with gold coating All specimens were thermocycled 1,000 times at temperature of 5degrees C to 55degrees C. The effects of gold electrodeposit on the shear bond strength between resin and metal interface were measured and fractured surface of the resin veneered metal was examined under the scaning electron microscope. The following results were obtained 1. The shear bond strength between resin and metal was 64.51+/-11.11Kg/cm2in Prec group, 62.77+/-11.23Kg/cm2in Base group and 58.97+/-9.20 Kg/cm2in Semi Group. There was no significant difference among the groups. 2. The bond strength in groups Semi-G and Base-G decreased about 17%, compared to the non-gold-electrodeposit groups(Semi, Base). 3. In groups of non electrodeposit(Prec, Semi, Base), fracture occurred at the interface between alloy and resin, while fracture interface was observed between gold coating and resin in group Semi-G, and between metal substrate and gold coating in group Base-G resp[ectively.
